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BD1754HFN
● Selection of Components Externally Connected
<Capacitor>
Datasheet
Symbol Recommended value
Recommended component
Manufacturer
Cin
0.1μF
GRM188B31H104KA92B
MURATA
<Resistor>
Symbol
R ISET
Recommended value
120k ?
Recommended component
MCR10PZHZF1203
Manufacturer
ROHM
● Recommended PCB Layout
Design PCB pattern to provide low impedance for the wiring to the power supply line.
Also, provide a bypass capacitor if needed.
LED_PWR
LED_PWR
L4
L3
L2
L1
Connect Cin input-bypass
capacitor in close proximity
EN
GND
ISET
VIN
between the VIN and GND pins.
Connect the R ISET resistor in
close proximity to the ISET pin.
R ISET
Cin
R ISET
EN
GND
VIN
EN
GND
VIN
Figure 23. Layout image of the application components (Top View)
Figure 24. Surface (Top View)
<Heat radiation PAD of back side>
PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin.
Moreover, connect ground plane (GND) of board using via as shown in the patterns of next page.
The efficiency of heat radiation improves according to the area of ground plane (GND).
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
13/16
TSZ02201-0G3G0C200060-1-2
9.NOV.2012 Rev.001
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